DUO remover
Low metal attack/PM process
Wafer backside polisher
Low temp etch to customer specified roughness


 

Advanced Polysilicon removal
High selectivity/performance
TARC
Low cost replacement
Selective Siloxane etchant
3-layer lithography rework


 

Wafer reclaim solution
Low TOC and solvent-free
Cu stripper
Low residue recipe

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